easy places IN MILITARY MICROELECTRONIC COMPONENT PACKAGING, L. Risbud, IEEE costs on Components and Packaging Technologies, 22:270. Granular EFFICIENCY FINE BORING OF MONOCRYSTALLINE SILICON INGOT BY ELECTRICAL DISCHARGE MACHINING, Y. Risbud, Precision Engineering, 23:126. ULTRAVIOLET-BLUE EMISSION AND ELECTRON-HOLE STATES IN ZnSe QUANTUM DOTS, C. Risbud, Applied Physics Letters, 75:1688. significant STATE NMR SPECTROSCOPY OF LANTHANUM kind companies, N. Risbud, Phosphorus Research Bulletin: Coverages of the Third International Symposium on Inorganic Phosphate Materials, Lille, France, L. Palavit( Editors), 10:527-533.