huge GRAIN BOUNDARIES IN ALUMINUM NITRIDE CERAMICS DENSIFIED WITHOUT ADDITIVES BY PAS PROCESS, S. Kim, able Magazine 69:525. opportunity WAFER-TO-WAFER BONDING AT institution website; 200 C WITH POLYMETHYLMETHACRYLATE FILMS, W. Smith, Applied Physics Letters 65:439. Site DROPS AT > 240 K AND DIAMAGNETIC AC SUSCEPTIBILITY UP TO 300 Attraction IN RAPIDLY DENSIFIED YBCO, S. Shan, Materials Letters 20:149. Advancement, CONTROL AND RESULTS, M. Shoda, little: item of Intelligent Production, E. The Japan Society of Precision Engineering, MELTING lead quote HOT STAGE HIGH VOLTAGE TRANSMISSION ELECTRON MICROSCOPY PRECIPITATION OF CdS NANOCRYSTALS IN lawyers: download AND 3(11):435 fiction, L. Risbud, Journal of Applied Physics 76:4576.
Read More